Professor Jimin Kwon in the Department of Electrical Engineering at UNIST has been selected for the highly esteemed 2023 Core Technology R&D Project to Support the National Semiconductor Lab. Hosted by the Korean Ministry of Science and ICT (MSIT), the project aims to drive innovation in the semiconductor industry. Professor Kwon’s selection grants him the opportunity to conduct cutting-edge research in advanced semiconductor packaging, with a budget of 2.55 billion won, including 2.25 billion won in government subsidies, by 2027.
Semiconductor packaging is a crucial process that involves the electrical connection and protection of semiconductor chips. As miniaturization processes approach their limits, the importance of this technology has become increasingly prominent.
Under the guidance of Professor Kwon, his team will focus on developing a high-efficiency substrate and chip connection technology using 3D printing for semiconductor packaging. Their objective is to create a packaging solution that enables the small-scale production of diverse types through the utilization of 3D printing. The developed packaging technology will be verified in collaboration with Turnell Co., Ltd., a leading ternary semiconductor fabless company, founded by Professor Kyung Rok Kim in the Department of Electrical and Electronic Engineering at UNIST.
This selection is expected to boost research in semiconductor processes based on UNIST’s material parts. Collaboration between the Department of Electrical and Electronic Engineering, the Graduate School of Semiconductor Materials and Parts, and the National Semiconductor Research Institute will facilitate organic collaboration. Demand companies, such as STI Co., Ltd. and Duksan Hi-Metal Co., Ltd., will actively participate in the project, and the transfer of the developed technology is anticipated to enhance their competitiveness in semiconductor packaging. Additionally, Ulsan City will contribute 200 million won to support regional manufacturing technology innovation.
The Core Technology R&D Project to Support the National Semiconductor Lab was launched in the first half of this year to secure patents for semiconductor technology hegemony. Out of the ten universities selected in the second half of this year, Professor Kwon’s laboratory was the only one chosen in the field of advanced semiconductor packaging.
